The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 19, 2024
Filed:
May. 04, 2021
The Procter & Gamble Company, Cincinnati, OH (US);
Sally Lin Kilbacak, Cincinnati, OH (US);
Donald Carroll Roe, West Chester, OH (US);
Jeromy Thomas Raycheck, South Lebanon, OH (US);
Uwe Schneider, Cincinnati, OH (US);
Michael Devin Long, Harrison Township, OH (US);
Michael Brian Quade, Blue Ash, OH (US);
Jason Edward Naylor, Loveland, OH (US);
Jeffry Rosiak, Loveland, OH (US);
Stephen Joseph Lange, Cincinnati, OH (US);
Urmish Popatlal Dalal, Milford, OH (US);
Christopher Krasen, Cincinnati, OH (US);
Todd Douglas Lenser, Liberty Township, OH (US);
The Procter & Gamble Company, Cincinnati, OH (US);
Abstract
An absorbent article includes a first waist region, a second waist region, and a crotch region disposed between the first and second waist regions; and a chassis having a topsheet, a backsheet, and an absorbent core positioned between the topsheet and the backsheet. The article also includes a side panel having an ultrasonically bonded, gathered laminate. The laminate has an elastomeric layer and a substrate and is joined to the chassis at a chassis attachment bond and positioned in one of the first or second waist regions. The ultrasonically bonded, gathered laminate also includes an ear structural feature comprising a surface modification to the substrate and comprising at least one of the following: embossing, apertures, perforations, slits, melted material or coatings, compressed material, secondary bonds that are disposed apart from a chassis attachment bond, plastic deformation, and folds.