The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2024

Filed:

Aug. 31, 2021
Applicant:

Auras Technology Co., Ltd., New Taipei, TW;

Inventors:

Chien-Yu Chen, New Taipei, TW;

Tian-Li Ye, New Taipei, TW;

Jen-Hao Lin, New Taipei, TW;

Chien-An Chen, New Taipei, TW;

Assignee:

AURAS TECHNOLOGY CO., LTD., New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); B23K 31/02 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); F28D 21/00 (2006.01); F28F 9/18 (2006.01); H01L 23/473 (2006.01); B23K 101/14 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01); B23K 31/02 (2013.01); F28D 15/0233 (2013.01); F28D 15/046 (2013.01); F28F 9/18 (2013.01); H05K 7/20263 (2013.01); H05K 7/20336 (2013.01); H05K 7/2039 (2013.01); B23K 2101/14 (2018.08); F28F 2230/00 (2013.01); F28F 2245/00 (2013.01); F28F 2275/062 (2013.01); G06F 1/20 (2013.01);
Abstract

A liquid cooling head includes a bottom plate, a heat dissipation plate, a partition plate and an upper cover plate. The bottom plate includes an opening, and the heat dissipation plate, the partition plate and the upper cover plate are fixed to the bottom plate. The partition plate divides the opening into a plurality of cooling chambers, and each cooling chamber is equipped with a cooling liquid inlet, a cooling liquid outlet, a pump and an electric control device. The cooling liquid inlet and the cooling liquid outlet are formed in the upper cover plate, the pump is fluid-connected to the cooling liquid outlet, and the electric control device drives the pump to rotate, so that the cooling liquid flows through the cooling chamber to cool one heat source below the heat dissipation plate. In addition, a liquid cooling device with the liquid cooling head is also disclosed therein.


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