The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2024

Filed:

Dec. 11, 2020
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventor:

Hirofumi Owaki, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/335 (2011.01); H01R 12/71 (2011.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01); H05K 1/02 (2006.01); H05K 13/00 (2006.01);
U.S. Cl.
CPC ...
H04N 23/52 (2023.01); H01R 12/716 (2013.01); H04N 23/54 (2023.01); H05K 1/0209 (2013.01); H05K 13/0015 (2013.01); H01R 2201/18 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/1059 (2013.01);
Abstract

A camera module according to an embodiment of the present technology includes a first component-mounting board, a second component-mounting board, and a spacer component. The first component-mounting board includes an imaging device. The second component-mounting board is electrically connected to the first component-mounting board. The spacer component is arranged between the first component-mounting board and the second component-mounting board. The spacer component includes a component body that is made of a first insulating material. The component body including a first primary-surface portion that includes a plurality of first reference surfaces including at least three first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces including at least three second reference surfaces, and a component accommodation portion with or without a bottom, the first primary-surface portion being brought into contact with the first component-mounting board, the second primary-surface portion being brought into contact with the second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion.


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