The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2024

Filed:

Feb. 02, 2021
Applicant:

Mitsubishi Chemical Corporation, Tokyo, JP;

Inventors:

Tomohiro Kawai, Tokyo, JP;

Hiroki Hayami, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 10/651 (2014.01); H01M 10/052 (2010.01); H01M 10/647 (2014.01); H01M 10/6555 (2014.01); H01M 10/6557 (2014.01); H01M 10/6567 (2014.01); H01M 10/658 (2014.01); H01M 50/105 (2021.01); H01M 50/124 (2021.01); H01M 50/129 (2021.01); H01M 50/133 (2021.01); H01M 50/211 (2021.01); H01M 50/291 (2021.01);
U.S. Cl.
CPC ...
H01M 10/651 (2015.04); H01M 10/052 (2013.01); H01M 10/647 (2015.04); H01M 10/6555 (2015.04); H01M 10/6557 (2015.04); H01M 10/6567 (2015.04); H01M 10/658 (2015.04); H01M 50/105 (2021.01); H01M 50/124 (2021.01); H01M 50/133 (2021.01); H01M 50/211 (2021.01); H01M 50/291 (2021.01); H01M 50/129 (2021.01);
Abstract

A filling member is interposed between pouch cells of a battery pack, the filling member has a first surface orthogonal to a thickness direction thereof and a second surface opposite to the first surface, θand θdefined below satisfy formulas (1) and (2) below, respectively, θsatisfies formula (3) below, and θ>θholds: (1) θ≥3.0×10(m·K)/W, (2) θ≤8.0×10(m·K)/W, (3) 0.5 K/W≤θ≤1000 K/W, and (4) 0.5 K/W≤θ≤1000 K/W. θis heat transfer resistance when the average temperature of one of the first and second surfaces exceeds 180° C., θis heat transfer resistance when the average temperatures of the first and second surfaces both do not exceed 80° C., θis heat transfer resistance when the average temperature exceeds 180° C., θis heat transfer resistance when the average temperatures do not exceed 80° C.


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