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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11929423 B1

PDFFull Text
Date of Patent:
Mar. 12, 2024

Filed:

Jun. 15, 2021

Etching platinum-containing thin film using protective cap layer

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Sebastian Meier, Munich, DE;

Helmut Rinck, Moosburg, DE;

Mike Mittelstaedt, Berglern, DE;

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Yudong Kim

Frank D. Cimino

Primary Examiner:

Shouxiang Hu

Int. Cl.
CPC ...
H01L 29/66 (2006.01); C01G 55/00 (2006.01); H01L 21/02 (2006.01); H01L 21/263 (2006.01); H01L 21/28 (2006.01); H01L 21/285 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01L 29/49 (2006.01); H01L 29/78 (2006.01); H01L 49/02 (2006.01); H01L 21/8238 (2006.01);
U.S. Cl.
CPC ...
H01L 29/665 (2013.01); C01G 55/00 (2013.01); C01G 55/004 (2013.01); H01L 21/02068 (2013.01); H01L 21/2633 (2013.01); H01L 21/28052 (2013.01); H01L 21/28518 (2013.01); H01L 21/31122 (2013.01); H01L 21/32134 (2013.01); H01L 21/32139 (2013.01); H01L 21/76885 (2013.01); H01L 21/76895 (2013.01); H01L 23/53242 (2013.01); H01L 24/00 (2013.01); H01L 28/24 (2013.01); H01L 29/4975 (2013.01); H01L 29/6659 (2013.01); H01L 29/7833 (2013.01); H01L 21/76834 (2013.01); H01L 21/823814 (2013.01); H01L 21/823835 (2013.01);
Abstract

A microelectronic device includes a substrate a platinum-containing layer over the substrate. The platinum-containing layer includes a first segment and a second segment adjacent to the first segment, and has a first surface and a second surface opposite the first surface closer to the substrate than the first surface. A first spacing between the first segment and the second segment at the first surface is greater than a second spacing between the first segment and the second segment at the second surface. A width of the first segment along the first surface is less than twice a thickness of the first segment, and the second spacing is less than twice the thickness of the first segment.

Find Patent Forward Citations

Meier, Sebastian. (2024). Etching platinum-containing thin film using protective cap layer (U.S. Patent No. 11929423). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11929423

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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