The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Mar. 08, 2021
Mitsubishi Electric Corporation, Tokyo, JP;
Julio Cezar Brandelero, Rennes, FR;
Stefan Mollov, Rennes, FR;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
The present invention concerns a method and a device for increasing the reliability of a power module composed of plural power semiconductors that are connected in parallel, the power semiconductors being connected to the external pins of the package of the power module through metallic connections. The invention: —selects one power semiconductor among the power semiconductors connected in parallel according to a criterion, —applies a same input patient to the not selected power semiconductors connected in parallel, —increases the temperature of the selected power semiconductor in order to reach a target temperature of the power semiconductor during a time duration in order to achieve and interface grain homogenisation of the metallic connections of the selected power semiconductor, —applies the same input pattern to the selected power semiconductor after the time duration.