The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Jan. 15, 2020
Hitachi Astemo, Ltd., Hitachinaka, JP;
Yusuke Takagi, Hitachinaka, JP;
Ryo Terayama, Hitachinaka, JP;
Ko Hamaya, Hitachinaka, JP;
Osamu Ikeda, Tokyo, JP;
Hitachi Astemo, Ltd., Hitachinaka, JP;
Abstract
A power semiconductor module, which is a semiconductor device, includes a semiconductor elementand a lead framethat is disposed to face the semiconductor elementand connected to the semiconductor elementby a solder material. The lead framehas the top surfaceincluding a surface facing the semiconductor element, and the side surfaceconnected to the peripheral edge portionof the top surfaceat a predetermined angle with respect to the top surface. The top surface of the lead frameincludes the solder surfacethat is in contact with the solder materialand the solder resistance surface on which the solder materialis less wettable than on the solder surface. The solder resistance surface is formed to surround the periphery of the solder surface. In this manner, when the semiconductor element and the lead frame are solder-joined in the semiconductor device, the region where the solder wet-spreads is appropriately controlled.