The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Dec. 15, 2021
Applicants:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Toshiba Electronic Devices & Storage Corporation, Tokyo, JP;
Inventor:
Kakeru Yamaguchi, Yokohama, JP;
Assignees:
KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49513 (2013.01); H01L 23/49544 (2013.01); H01L 23/49555 (2013.01);
Abstract
A semiconductor device of an embodiment includes a first lead frame, a second lead frame located apart from the first lead frame, a semiconductor chip mounted on the first lead frame, and a conductive member. The conductive member electrically connects an electrode of the semiconductor chip to the second lead frame through a conductive adhesive. The conductive member includes a cut face located apart from a bonding face of the electrode, on which the conductive member is bonded.