The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Jun. 19, 2019
Applicant:
Dexerials Corporation, Tokyo, JP;
Inventors:
Yusuke Kubo, Tokyo, JP;
Sergey Bolotov, Tokyo, JP;
Assignee:
Dexerials Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/433 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4334 (2013.01); H01L 21/56 (2013.01); H01L 23/367 (2013.01); H01L 23/3733 (2013.01);
Abstract
Provided is a semiconductor device having excellent heat dissipation capacity and electromagnetic wave suppression effect. A semiconductor deviceincludes a semiconductor element; a conductive cooling memberprovided above the semiconductor element, a conductive thermally conductive memberthat is provided between the semiconductor elementand the cooling memberand contains a cured resin. The conductive thermally conductive memberis connected to a groundin the substrateto electrically connect the cooling memberand the ground