The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Aug. 24, 2021
Applied Materials, Inc., Santa Clara, CA (US);
Fang Jie Lim, Singapore, SG;
Chin Wei Tan, Singapore, SG;
Jun-Liang Su, Singapore, SG;
Felix Deng, Singapore, SG;
Sai Kumar Kodumuri, Singapore, SG;
Ananthkrishna Jupudi, Singapore, SG;
Nuno Yen-Chu Chen, Singapore, SG;
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Abstract
Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.