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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11929250 B1

PDFFull Text
Date of Patent:
Mar. 12, 2024

Filed:

Mar. 01, 2022

Substrate processing apparatus, substrate processing method and a semiconductor device manufacturing method

Applicant:

Kioxia Corporation, Tokyo, JP;

Inventors:

Katsuhiro Sato, Yokkaichi Mie, JP;

Hiroshi Fujita, Mie Mie, JP;

Tatsuhiko Koide, Kuwana Mie, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:

Kim & Stewart LLP

Primary Examiner:

Tinsae B Ayalew

Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/673 (2006.01); H10B 41/00 (2023.01); H10B 43/00 (2023.01);
U.S. Cl.
CPC ...
H01L 21/0206 (2013.01); H01L 21/02068 (2013.01); H01L 21/67034 (2013.01); H01L 21/67057 (2013.01); H01L 21/673 (2013.01); H01L 21/67313 (2013.01); H10B 41/00 (2023.02); H10B 43/00 (2023.02);
Abstract

According to one embodiment, a substrate processing apparatus includes a batch type cleaning unit, a holding unit, and a single-substrate type drying unit. The batch type cleaning unit simultaneously cleans a plurality of substrates in a batch process with a first liquid. The holding unit receives the cleaned substrates while still wet and then keeps a first surface of each of the substrates wet with the first liquid. The single-substrate type drying unit is configured to receive the substrates one by one from the holding unit and then dry off the substrates one by one.

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Sato, Katsuhiro. (2024). Substrate processing apparatus, substrate processing method and a semiconductor device manufacturing method (U.S. Patent No. 11929250). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11929250

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