The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2024

Filed:

Aug. 08, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Roman Gouk, San Jose, CA (US);

Jean Delmas, Santa Clara, CA (US);

Steven Verhaverbeke, San Francisco, CA (US);

Chintan Buch, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); B29C 45/37 (2006.01); B29C 59/02 (2006.01); B29K 23/00 (2006.01); H01L 21/027 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 45/372 (2013.01); B29C 59/022 (2013.01); H01L 21/0274 (2013.01); H01L 21/76817 (2013.01); B29K 2023/16 (2013.01);
Abstract

An imprint lithography stamp includes a stamp body having a patterned surface and formed from a fluorinated ethylene propylene copolymer. The imprint lithography stamp further includes a backing plate with a plurality of through-holes with portions of the stamp body extending into the through-holes to adhere the stamp body to the backing plate. The patterned surface of the stamp body has a plurality of protrusions extending from the stamp body, which are used to form high aspect ratio features at high processing temperatures. A mold design for forming the imprint lithography stamp and an injection molding process for forming the imprint lithography stamp are also provided.


Find Patent Forward Citations

Loading…