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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11927884 B1

PDFFull Text
Date of Patent:
Mar. 12, 2024

Filed:

Feb. 08, 2018

Resin molded article production method and optical component production method

Applicant:

Daicel Corporation, Osaka, JP;

Inventors:

Takeshi Fujikawa, Himeji, JP;

Sadayuki Fukui, Himeji, JP;

Assignee:

DAICEL CORPORATION, Osaka, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Benjamin A Schiffman

Int. Cl.
CPC ...
G03F 7/00 (2006.01); B05D 3/14 (2006.01); B29C 37/00 (2006.01); B29C 41/00 (2006.01); B29C 41/08 (2006.01); B29C 59/00 (2006.01); B29C 59/02 (2006.01); B29C 59/10 (2006.01); B29C 59/14 (2006.01); G02B 3/08 (2006.01); B29K 63/00 (2006.01); B29L 11/00 (2006.01); G02B 1/04 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B05D 3/14 (2013.01); B29C 37/006 (2013.01); B29C 41/006 (2013.01); B29C 41/08 (2013.01); B29C 59/002 (2013.01); B29C 59/022 (2013.01); B29C 59/10 (2013.01); B29C 59/14 (2013.01); G02B 3/08 (2013.01); B29C 2059/023 (2013.01); B29K 2063/00 (2013.01); B29L 2011/005 (2013.01); G02B 1/041 (2013.01);
Abstract

The present invention provides a method for producing a resin molded article through which air bubbles are not easily formed during imprint molding when a curable composition is applied to a mold having a pattern shaped section. The method for producing a resin molded article is a method for producing a resin molded article through imprint molding, the method including: a specific curable composition application process such as the curable composition application process (1) below, in which a curable composition having a contact angle of 50° or less on a mold having a pattern shaped section is applied to a portion of the mold uncoated with the curable composition; and a curing process in which the curable composition applied to the mold is cured to obtain a resin molded article; (1) a curable composition application process including a microparticle application step in which the curable composition is applied such that a particle size of microparticles of the curable composition when adhering to the mold is 0.5 mm or less.

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