The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2024

Filed:

Jun. 30, 2021
Applicant:

Hisense Broadband Multimedia Technologies Co., Ltd., Shandong, CN;

Inventors:

Long Zheng, Shandong, CN;

Sigeng Yang, Shandong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/38 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4281 (2013.01); G02B 6/3885 (2013.01); G02B 6/389 (2013.01); G02B 6/43 (2013.01); G02B 6/1203 (2013.01); G02B 6/387 (2013.01);
Abstract

An optical module has an optical port and an electrical port, and includes a shell, a circuit board, a circuit adapter board, a silicon optical chip, a light source and an optical fiber socket. The circuit board is disposed in the shell. One end of the circuit board is provided with a connecting finger located in the electrical port. The circuit adapter board is disposed on and electrically connected to the circuit board. A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board. The silicon optical chip is disposed on and electrically connected to the circuit adapter board. The light source is disposed on the circuit board, is electrically connected to the circuit board, and is optically connected to the silicon optical chip. The optical fiber socket is optically connected to the silicon optical chip, and is configured to form the optical port.


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