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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11926931 B1

PDFFull Text
Date of Patent:
Mar. 12, 2024

Filed:

Jun. 14, 2021

Resin powder for solid freeform fabrication, device for solid freeform fabrication object, and method of manufacturing solid freeform fabrication object

Applicant:

Ricoh Company, Ltd., Tokyo, JP;

Inventors:

Akira Saito, Kanagawa, JP;

Shigenori Yaguchi, Tokyo, JP;

Yasuyuki Yamashita, Kanagawa, JP;

Kiichi Kamoda, Kangawa, JP;

Yasuo Suzuki, Shizuoka, JP;

Nozomu Tamoto, Shizuoka, JP;

Hitoshi Iwatsuki, Kanagawa, JP;

Shinzo Higuchi, Tokyo, JP;

Sohichiroh Iida, Kanagawa, JP;

Assignee:

Ricoh Company, Ltd., Tokyo, JP;

Attorney:

Grüneberg and Myers PLLC

Primary Examiner:

Hoa (Holly) Le

Int. Cl.
CPC ...
D01F 6/00 (2006.01); B05D 3/06 (2006.01); B33Y 70/00 (2020.01); C08J 3/12 (2006.01); C08K 3/04 (2006.01); C08K 3/16 (2006.01); C08K 3/22 (2006.01); C08K 5/1575 (2006.01); C08K 5/527 (2006.01); C08K 7/14 (2006.01); C08K 7/20 (2006.01); D01F 1/07 (2006.01); D01F 1/10 (2006.01); D01F 6/06 (2006.01); D01F 6/66 (2006.01); D01F 6/80 (2006.01); D01F 6/84 (2006.01); B33Y 70/10 (2020.01);
U.S. Cl.
CPC ...
D01F 6/665 (2013.01); B05D 3/06 (2013.01); B33Y 70/00 (2014.12); C08J 3/12 (2013.01); C08K 3/046 (2017.05); C08K 3/16 (2013.01); C08K 3/2279 (2013.01); C08K 5/1575 (2013.01); C08K 5/527 (2013.01); C08K 7/14 (2013.01); C08K 7/20 (2013.01); D01F 1/07 (2013.01); D01F 1/10 (2013.01); D01F 6/06 (2013.01); D01F 6/66 (2013.01); D01F 6/80 (2013.01); D01F 6/84 (2013.01); B33Y 70/10 (2020.01); C08J 2323/12 (2013.01); C08J 2329/14 (2013.01); C08J 2367/02 (2013.01); C08J 2371/00 (2013.01); C08J 2377/06 (2013.01); Y10T 428/2982 (2015.01);
Abstract

A resin powder for solid freeform fabrication includes a particle having a pillar-like form, wherein the ratio of the height of the particle to the diameter or the long side of the bottom of the particle is 0.5 to 2.0, the particle has a 50 percent cumulative volume particle diameter of from 5 to 200 μm, and the ratio (Mv/Mn) of the volume average particle diameter (Mv) to the number average particle diameter (Mn) of the particle is 2.00 or less.

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