The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Jun. 07, 2021
Applicant:
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Inventors:
Brian Deegan, Blessington, IE;
Gavin Haberlin, Naas, IE;
Brendan Kneafsey, Lucan, IE;
Stephen Fearon, Swords, IE;
Assignee:
Henkel AG & Co. KGaA, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 5/02 (2006.01); B29C 65/00 (2006.01); B29C 65/48 (2006.01); B29C 65/82 (2006.01); C08J 5/12 (2006.01); C08J 7/12 (2006.01); C09J 7/25 (2018.01); C09J 7/35 (2018.01); C09J 7/38 (2018.01); C09J 7/50 (2018.01);
U.S. Cl.
CPC ...
C09J 5/02 (2013.01); B29C 65/483 (2013.01); B29C 65/8215 (2013.01); B29C 66/028 (2013.01); B29C 66/73921 (2013.01); C08J 5/124 (2013.01); C08J 7/123 (2013.01); C09J 7/255 (2018.01); C09J 7/35 (2018.01); C09J 7/38 (2018.01); C09J 7/50 (2018.01); C08J 2361/16 (2013.01); C08J 2367/02 (2013.01); C08J 2367/03 (2013.01); C08J 2379/08 (2013.01); C08J 2381/04 (2013.01); C08J 2479/08 (2013.01); C08J 2481/04 (2013.01); C09J 2301/416 (2020.08); C09J 2461/008 (2013.01); C09J 2467/008 (2013.01); C09J 2477/008 (2013.01); C09J 2479/088 (2013.01); C09J 2481/008 (2013.01);
Abstract
A method of activating a surface of a plastics substrate formed from: for subsequent bonding, the method comprising the step of exposing the surface to actinic radiation wherein the actinic radiation: includes radiation with wavelength in the range from about 10 nm to about 1000 nm; the energy of the actinic radiation to which the surface is exposed is in the range from about 0.5 J/cmto about 300 J/cm. Hard to bond substrates are then more easily subsequently bonded for example using acrylic, epoxy or anaerobic adhesive.