The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Feb. 17, 2023
Applicant:
Thintronics, Inc., Berkeley, CA (US);
Inventors:
Stefan J. Pastine, Berkeley, CA (US);
Yaroslav Klichko, Oakland, CA (US);
Assignee:
Thintronics, Inc., Berkeley, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 9/00 (2006.01); C08J 3/28 (2006.01); C08K 7/28 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08L 9/00 (2013.01); C08J 3/28 (2013.01); C08K 7/28 (2013.01); H05K 1/0373 (2013.01); C08J 2309/00 (2013.01); C08J 2471/02 (2013.01); C08L 2203/16 (2013.01); C08L 2203/20 (2013.01);
Abstract
A curable film and a cured product obtained by curing the curable film are disclosed. The curable film contains, as essential components, hollow glass microspheres and a rubber composition containing at least one diene-based rubber. The curable film is thin and has excellent processibilities. The cured product has desirable dielectric and thermomechanical characteristics that are suitable to be used as a dielectric material for printed circuit boards, especially for multilayer printed circuit boards and high-density interconnect printed circuit boards.