The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2024

Filed:

Nov. 12, 2020
Applicant:

Abc Technologies Inc., Toronto, CA;

Inventors:

Mosen Sepasi, Mississauga, CA;

Aram Khosh Ettekal, Toronto, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); B32B 3/30 (2006.01); B32B 5/02 (2006.01); B32B 27/12 (2006.01); B60R 13/02 (2006.01);
U.S. Cl.
CPC ...
B32B 3/30 (2013.01); B32B 5/022 (2013.01); B32B 27/12 (2013.01); B60R 13/02 (2013.01); B32B 2262/106 (2013.01); B32B 2451/00 (2013.01); B32B 2605/003 (2013.01);
Abstract

Provided is a composite sandwich panel. The composite sandwich panel includes a core, a first thermoplastic layer applied to a first side of the core, and a second thermoplastic layer applied to a second side of the core. The core is provided in the form of a wave board formed from natural fiber. Also provided is a process for manufacturing a composite sandwich panel. The process comprises extruding a first and second thermoplastic layer into respective flat sheets, forming a consolidated natural fibrous mat, and molding the consolidated natural fibrous mat into a consolidated core having a predetermined geometry. The first and second thermoplastic layers, as well as the consolidated core are heated to a predetermined molding temperature. The heated consolidated core is placed between the heated first and second thermoplastic layers, and the assembly is molded in a molding press into a desired shape determined by product design intent.


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