The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
May. 13, 2021
Nippon Steel Corporation, Tokyo, JP;
NIPPON STEEL CORPORATION, Tokyo, JP;
Abstract
This steel sheet for hot stamping includes a base material, an Al—Si alloy plating layer in which the Al content is 75 mass % or more, the Si content is 3 mass % or more and the total of the Al content and the Si content is 95 mass % or more and a Ni plating layer in which the Ni content is more than 90 mass % in this order, the chemical composition of the base material is, by mass %, C: 0.01% or more and less than 0.70%, Si: 0.005% to 1.000%, Mn: 0.40% to 3.00%, Nb: 0.010% to 0.200%, a solid solution of Nb: 0.010% to 0.150%, sol. Al: 0.00020% to 0.50000%, P: 0.100% or less, S: 0.1000% or less, N: 0.0100% or less, Cu: 0% to 1.00%, Ni: 0% to 1.00%, V: 0% to 1.00%, Ti: 0% to 0.150%, Mo: 0% to 1.000%, Cr: 0% to 1.000%, B: 0% to 0.0100%, Ca: 0% to 0.010%, REM: 0% to 0.300%, and a remainder: Fe and an impurity, the Al—Si alloy plating layer has a thickness of 7 to 148 μm, and the Ni plating layer has a thickness of more than 200 nm and 2500 nm or less.