The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2024

Filed:

Jun. 26, 2019
Applicant:

Hamilton Sundstrand Corporation, Charlotte, NC (US);

Inventors:

Faramarz M. Zarandi, Vernon, CT (US);

Jesus A. Garcia, San Diego, CA (US);

Evan J. Butcher, Suffield, CT (US);

Assignee:

HAMILTON SUNDSTRAND CORPORATION, Charlotte, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/105 (2006.01); B22F 3/15 (2006.01); B22F 3/24 (2006.01); B22F 5/00 (2006.01); B22F 5/04 (2006.01); B22F 7/08 (2006.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 10/38 (2021.01); B22F 10/64 (2021.01); C22C 1/04 (2023.01); C22C 19/03 (2006.01); C22F 1/10 (2006.01); F01D 5/04 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B22F 3/24 (2013.01); B22F 3/105 (2013.01); B22F 3/15 (2013.01); B22F 5/009 (2013.01); B22F 5/04 (2013.01); B22F 7/08 (2013.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 10/38 (2021.01); B22F 10/64 (2021.01); C22C 1/0433 (2013.01); C22C 19/03 (2013.01); C22F 1/10 (2013.01); F01D 5/048 (2013.01); B22F 2301/15 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12);
Abstract

Disclosed is a method of making a part, comprising: forming the part via an additive manufacturing process, wherein the additive manufacturing process comprises layering, melting, and solidifying a metal alloy based on a three dimensional numerical model, wherein the formed part comprises a microstructure, wherein the microstructure comprises an average columnar grain length; and heat treating the formed part, wherein heat treating comprises heating to between 750° C. and 1200° C. for a time between 0.5 hours and 10 hours and then cooling the formed part below 750° C., wherein after heat treating, the formed part has an average columnar grain length of about 400 micrometers to about 1000 micrometers, as measured using electron backscattered diffraction.


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