The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Jan. 14, 2021
Applicant:
The Sherwin-williams Company, Cleveland, OH (US);
Inventors:
Owen H. Decker, Smithville, MO (US);
Thomas E. Reno, Kansas City, MO (US);
Robert D. Breitzman, Liberty, MO (US);
Carlos A. Concha, Kansas City, MO (US);
Jeffrey D. Rogozinski, Kansas City, MO (US);
Assignee:
The Sherwin-Williams Company, Cleveland, OH (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/02 (2006.01); B05D 1/06 (2006.01); B05D 1/12 (2006.01); B05D 1/34 (2006.01); B05D 1/36 (2006.01); B05D 3/00 (2006.01); B05D 3/10 (2006.01); B05D 3/12 (2006.01); B05D 5/02 (2006.01); B05D 7/00 (2006.01); B05D 7/14 (2006.01); C08K 3/22 (2006.01); C08K 5/29 (2006.01); C08K 5/32 (2006.01); C08K 5/3445 (2006.01); C09D 5/03 (2006.01); C09D 163/00 (2006.01); C23C 24/00 (2006.01); C23C 26/00 (2006.01); C23C 28/00 (2006.01); B32B 7/02 (2019.01); C09D 167/00 (2006.01); C09D 167/02 (2006.01); C09D 167/03 (2006.01);
U.S. Cl.
CPC ...
B05D 7/542 (2013.01); B05D 1/06 (2013.01); B05D 1/12 (2013.01); B05D 1/36 (2013.01); B05D 3/002 (2013.01); B05D 3/0218 (2013.01); B05D 3/0254 (2013.01); B05D 3/102 (2013.01); B05D 3/12 (2013.01); B05D 7/14 (2013.01); C08K 3/22 (2013.01); C08K 5/29 (2013.01); C08K 5/32 (2013.01); C08K 5/3445 (2013.01); C09D 5/03 (2013.01); C09D 5/035 (2013.01); C09D 163/00 (2013.01); C23C 24/00 (2013.01); C23C 26/00 (2013.01); C23C 28/00 (2013.01); B05D 2202/10 (2013.01); B05D 2451/00 (2013.01); B32B 7/02 (2013.01); C08K 2003/2241 (2013.01); C09D 167/00 (2013.01); C09D 167/02 (2013.01); C09D 167/03 (2013.01); Y10T 428/31529 (2015.04);
Abstract
Methods and systems for coating metal substrates are provided. The methods and systems include sequential application of low flow and high flow powder coatings followed by a single heating step to provide a cured coating. The methods and systems include a marker that allows coating uniformity to be monitored and assessed during application. The described methods provide coatings with optimal surface smoothness and edge coverage.