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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11925100 B1

PDFFull Text
Date of Patent:
Mar. 05, 2024

Filed:

Sep. 02, 2021

Display module and display device

Applicant:

Wuhan Tianma Micro-electronics Co., Ltd., Wuhan, CN;

Inventors:

Xiangwei Zhao, Wuhan, CN;

Jiang Li, Wuhan, CN;

Guancheng Xiao, Wuhan, CN;

Ruiyuan Zhou, Wuhan, CN;

Assignee:

Wuhan Tianma Micro-Electronics Co., Ltd., Wuhan, CN;

Attorney:

Alston & Bird LLP

Primary Examiner:

Kyoung Lee

Int. Cl.
CPC ...
H10K 77/10 (2023.01); B32B 5/18 (2006.01); B32B 7/12 (2006.01); B32B 15/04 (2006.01); B32B 15/09 (2006.01); B32B 15/20 (2006.01); B32B 27/36 (2006.01); C09J 7/38 (2018.01); H10K 59/12 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 77/111 (2023.02); B32B 5/18 (2013.01); B32B 7/12 (2013.01); B32B 15/046 (2013.01); B32B 15/09 (2013.01); B32B 15/20 (2013.01); B32B 27/36 (2013.01); C09J 7/385 (2018.01); H10K 59/12 (2023.02); B32B 2266/0214 (2013.01); B32B 2457/20 (2013.01); C09J 2203/326 (2013.01); C09J 2400/10 (2013.01); C09J 2433/00 (2013.01); H10K 2102/311 (2023.02);
Abstract

A display module includes substrate and adhesive portion. Substrate includes display portion, bending portion and bonding portion located on non-light-emitting side of display portion. Bending portion is located between display portion and bonding portion. Adhesive portion includes first adhesive portion including first adhesive sub-portion and second adhesive sub-portion located on side of first adhesive sub-portion facing away from bending portion. Bonding portion includes first bonding sub-portion at least partially overlapping first adhesive sub-portion in a first direction and second bonding sub-portion located on side of first bonding sub-portion facing away from bending portion at least partially overlapping second adhesive sub-portion in the first direction. In a first state, the distance between first bonding sub-portion and display portion is greater than the distance between second bonding sub-portion and display portion in first direction, thereby alleviating stress bonding portion withstands, and ensuring normal operation of display module in first state.

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