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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11925091 B1

PDFFull Text
Date of Patent:
Mar. 05, 2024

Filed:

Jan. 13, 2021

Light emitting display device and manufacturing method thereof

Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Hyeon Bum Lee, Hwaseong-si, KR;

Choong Youl Im, Yongin-si, KR;

Ha Seok Jeon, Seoul, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Yongin-si, KR;

Attorney:

KILE PARK REED & HOUTTEMAN PLLC

Primary Examiner:

Dismery Mercedes

Int. Cl.
CPC ...
H10K 59/38 (2023.01); G06F 3/041 (2006.01); H10K 50/86 (2023.01); H10K 59/124 (2023.01); H10K 59/131 (2023.01); H10K 59/40 (2023.01); H10K 71/00 (2023.01); G06F 3/044 (2006.01); H10K 59/12 (2023.01); H10K 59/35 (2023.01);
U.S. Cl.
CPC ...
H10K 59/38 (2023.02); G06F 3/0412 (2013.01); H10K 50/865 (2023.02); H10K 59/124 (2023.02); H10K 59/131 (2023.02); H10K 59/40 (2023.02); H10K 71/00 (2023.02); G06F 3/0443 (2019.05); G06F 3/0446 (2019.05); G06F 2203/04103 (2013.01); G06F 2203/04111 (2013.01); H10K 59/1201 (2023.02); H10K 59/35 (2023.02);
Abstract

A light emitting display device includes a substrate including a display area and a non-display area adjacent to the display area, a lower pad electrode disposed on the substrate in the non-display area, a lower planarization layer disposed on the lower pad electrode and including a via hole exposing an upper surface of the lower pad electrode, an upper pad electrode disposed on the lower pad electrode, the upper pad electrode being electrically connected to the lower pad electrode through the via hole, and a covering layer in contact with a side surface portion of the upper pad electrode, the side surface portion of the upper pad electrode being disposed on the lower planarization layer.

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