The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2024

Filed:

Jan. 14, 2022
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Yusuke Kamitsubo, Nagaokakyo, JP;

Tomohiro Furumura, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4635 (2013.01); H05K 1/0277 (2013.01); H05K 1/036 (2013.01); H05K 3/4688 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/09827 (2013.01);
Abstract

A method for manufacturing a multilayer substrate including first and second insulating resin base material layers including different materials, includes configuring a conductor film-attached insulating resin base material with a conductor film on the first insulating resin base material layer, or a second conductor film-attached insulating resin base material with a conductor film on a main surface of the first insulating resin base material layer including a main surface of a stacked body including at least the first insulating resin base material layer, and stacking the first or second conductor film-attached insulating resin base material and another base material layer such that the conductor film is in contact with the second insulating resin base material layer. An adhesion strength of the first insulating resin base material layer to the conductor film is higher than an adhesion strength of the second insulating resin base material layer to the conductor film.


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