The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2024

Filed:

Sep. 08, 2021
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventor:

Makoto Sano, Ota Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/38 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0251 (2013.01); H05K 1/115 (2013.01); H05K 3/366 (2013.01); H05K 2201/10098 (2013.01);
Abstract

According to one embodiment, a substrate includes a first dielectric substrate with a first through-hole, a second dielectric substrate with a first conductive via, a first signal line provided between the first dielectric substrate and the second dielectric substrate, a third dielectric substrate with a second conductive via, a first planar conductor provided between the second and third dielectric substrates and located away from the first and second conductive vias, a fourth dielectric substrate, and a second signal line provided between the third and fourth dielectric substrates. At least a part of a first inner wall of the first through-hole is not covered with a conductor. The first through-hole and the first conductive via partially overlap in a first direction. The first and second conductive vias partially overlap in the first direction. The second conductive via and the second signal line partially overlap in the first direction.


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