The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2024
Filed:
Jul. 21, 2021
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventor:
Hisanori Murase, Kyoto, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/38 (2015.01); H01Q 1/22 (2006.01); H03H 7/38 (2006.01); H04B 1/16 (2006.01);
U.S. Cl.
CPC ...
H04B 1/38 (2013.01); H01Q 1/2283 (2013.01); H03H 7/38 (2013.01); H04B 1/1615 (2013.01);
Abstract
A high-frequency module () includes a mounting substrate (), a transmission filter (MT) arranged on the mounting substrate (), a reception filter (MR) arranged on the mounting substrate (), and a semiconductor control IC () arranged on the mounting substrate () and stacked with the reception filter (MR) of the transmission filter (MT) and the reception filter (MR).
Murase, Hisanori. (2024). High-frequency module and communication apparatus (U.S. Patent No. 11923885). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11923885
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile