The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2024
Filed:
Dec. 09, 2021
Applicant:
Amazon Technologies, Inc., Seattle, WA (US);
Inventor:
Bassam Abdel-Dayem, Santa Clara, CA (US);
Assignee:
Amazon Technologies, Inc., Seattle, WA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/10 (2006.01); H01L 21/52 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H05K 7/14 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 21/52 (2013.01); H01L 23/49833 (2013.01); H01L 23/5385 (2013.01); H01L 25/50 (2013.01); H05K 7/1488 (2013.01);
Abstract
A semiconductor package can include a unitary substrate defining a first region and a second region. A first interposer can be mounted on the unitary substrate in the first region, and a first die can be mounted on the first interposer. A second interposer can be mounted in the second region on the unitary substrate, and a second die can be mounted on the second interposer.