The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2024

Filed:

Mar. 03, 2021
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Masayuki Akou, Yokohama, JP;

Assignee:

Kioxia Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/522 (2006.01); H10B 41/27 (2023.01); H10B 41/41 (2023.01); H10B 43/27 (2023.01); H10B 43/40 (2023.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 23/5226 (2013.01); H10B 41/27 (2023.02); H10B 41/41 (2023.02); H10B 43/27 (2023.02); H10B 43/40 (2023.02); H01L 2224/05025 (2013.01);
Abstract

A semiconductor memory device includes a substrate, a memory cell array separated from the substrate, and a plurality of first bonding pad electrodes away from the memory cell array. The substrate includes a plurality of first and second regions arranged alternately. The memory cell array includes a plurality of conductive layers extending across the plurality of first and second regions, a plurality of semiconductor layers disposed in the plurality of first regions, and a plurality of first contacts disposed in the plurality of second regions. When a distance between a center position of the first bonding pad electrode and a center position of the first contact closest to the first bonding pad electrode is defined as a first distance, a difference between a largest first distance and a smallest first distance among a plurality of first distances is 400 nm or less.


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