The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2024

Filed:

Aug. 31, 2020
Applicant:

Kioxia Corporation, Tokyo, JP;

Inventor:

Atsushi Kato, Yokkaichi Mie, JP;

Assignee:

KIOXIA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76849 (2013.01); H01L 21/7685 (2013.01); H01L 21/76856 (2013.01); H01L 21/76864 (2013.01); H01L 24/08 (2013.01); H01L 21/7684 (2013.01); H01L 2224/08112 (2013.01); H01L 2224/08145 (2013.01);
Abstract

A semiconductor device includes a first substrate, a logical circuit, a first insulating film, a wiring, a plug, and a first layer containing a metal oxide or a metal nitride. The logical circuit is disposed on the first substrate. The first insulating film is disposed above the logical circuit. The wiring includes a first film disposed in the first insulating film, the first film extending in a first direction along an upper surface of the first substrate, and the first film containing a metal, and a first metal layer disposed in the first insulating film via the first film. The plug is disposed under the wiring, extends in a second direction that intersects the first direction, and is electrically connected to the wiring. The first layer is provided between an upper end of the plug and a bottom end of the wiring.


Find Patent Forward Citations

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Kato, Atsushi. (2024). Via connection to wiring in a semiconductor device (U.S. Patent No. 11923291). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11923291

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