The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2024

Filed:

Apr. 07, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mark D. Schultz, Ossining, NY (US);

Fuad Elias Doany, Katonah, NY (US);

Benjamin Giles Lee, Ridgefield, CT (US);

Daniel M. Kuchta, Patterson, NY (US);

Christian Wilhelmus Baks, Pleasant Valley, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/367 (2006.01); G02B 6/42 (2006.01); H01L 25/16 (2023.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); G02B 6/4269 (2013.01); H01L 25/167 (2013.01); H01L 23/49833 (2013.01);
Abstract

An optical module includes an optoelectronic assembly and a heat spreader. The optoelectronic assembly includes a flat, rigid substrate, an array of electrical contacts positioned on a first portion of the substrate, and an optoelectronics assemblage that is electrically connected to the array of contacts and is positioned apart from the array of electrical contacts. The heat spreader is comprised of a thermally conductive material and comprises a second portion that is structurally connected to the first portion and a third portion that is thermally connected to the optoelectronics assemblage.


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