The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2024
Filed:
Sep. 28, 2021
Applicant:
Sansha Electric Manufacturing Co., Ltd., Osaka, JP;
Inventor:
Koutarou Maeda, Osaka, JP;
Assignee:
Sansha Electric Manufacturing Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 21/56 (2006.01); H01L 23/053 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 21/565 (2013.01); H01L 23/053 (2013.01);
Abstract
A semiconductor chip is provided on a semiconductor circuit base on one surface of an insulating substrate. A reinforcement and balance base is provided on the one surface of the insulating substrate spaced to the semiconductor circuit base. The insulating substrate, the semiconductor circuit base, the semiconductor chip, and the reinforcement and balance base are sealed into a resin-molded sealing body. The sealing body has resin non-adhering portions.