The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2024

Filed:

Apr. 06, 2023
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Chia-Hsiung Chang, Miao-Li County, TW;

Ting-Kai Hung, Miao-Li County, TW;

Hsiao-Lang Lin, Miao-Li County, TW;

Assignee:

INNOLUX CORPORATION, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01L 21/66 (2006.01); H01L 25/00 (2006.01); H01L 33/44 (2010.01); H01L 33/52 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 27/12 (2006.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 22/22 (2013.01); H01L 25/167 (2013.01); H01L 25/50 (2013.01); H01L 33/44 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 27/1214 (2013.01); H01L 33/50 (2013.01); H01L 33/60 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Methods for manufacturing an electronic device are provided. A representative method includes providing a substrate. The substrate has an active layer, a first patterned metal layer passing through a passivation layer to electrically connected to the active layer, a second patterned metal layer passing through an insulating layer to electrically connected to the first patterned metal layer, and a metal layer under the second patterned metal layer. A part of the metal layer does not serve as a portion of a thin film transistor, and the part of the metal layer serves as a portion of a gate line. The method includes providing a carrier substrate supporting a plurality of elements, conducting a testing to the elements, transferring the elements from the carrier substrate to the second patterned metal layer of the substrate, and fixing the elements to the substrate.


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