The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2024

Filed:

Aug. 25, 2021
Applicant:

Ngk Insulators, Ltd., Aichi, JP;

Inventors:

Tomoki Nagae, Nagoya, JP;

Yoshimasa Kondo, Nagoya, JP;

Yusuke Ogiso, Nagakute, JP;

Katsunao Uenishi, Nagoya, JP;

Atsushi Watanabe, Kasugai, JP;

Ayato Koizumi, Nagoya, JP;

Assignee:

NGK INSULATORS, LTD., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/407 (2006.01);
U.S. Cl.
CPC ...
G01N 27/4074 (2013.01); G01N 27/4076 (2013.01); G01N 27/4077 (2013.01); G01N 27/4078 (2013.01);
Abstract

A sensor element includes an element body and a porous protective layer arranged to cover a part of a surface of the element body. The protective layer includes an inlet protective layer arranged to cover a gas inlet formed in the surface of the element body, and at least a part of a face included in the surface of the element body, the face on which the gas inlet is opens, and an arithmetic average roughness Rap of an inner peripheral surface of an internal space of the inlet protective layer satisfies at least one of conditions below: the arithmetic average roughness Rap is 8 μm or more, and the arithmetic average roughness Rap is higher than an arithmetic average roughness Rac of a bonding surface of the protective layer, the bonding surface at which the protective layer is bonded to the element body.


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