The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2024

Filed:

Aug. 31, 2022
Applicant:

Nidec Corporation, Kyoto, JP;

Inventors:

Toshihiko Tokeshi, Kyoto, JP;

Genki Horiguchi, Kyoto, JP;

Takehito Tamaoka, Kyoto, JP;

Takaya Okuno, Kyoto, JP;

Assignee:

NIDEC CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 9/26 (2006.01); F04D 13/14 (2006.01); F04D 29/58 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
F28F 9/262 (2013.01); F04D 13/14 (2013.01); F04D 29/586 (2013.01); F28F 2250/08 (2013.01); H01L 23/473 (2013.01);
Abstract

A heat dissipation device includes a radiator, a first tank, and a pump assembly. The radiator cools liquid and extends in a first direction. The first tank is connected to the radiator, and the liquid passes through the first tank. The pump assembly is connected to the first tank and circulates the liquid flowing in from the first tank. The radiator includes a pipe through which the liquid passes. The pipe extends along the first direction. The pump assembly is located on one side in the first direction of the radiator. The pump assembly includes a first pump, a second pump, and a flow path portion. The first pump feeds and circulates the liquid. The second pump feeds and circulates the liquid. The flow path portion guides the liquid fed from the first pump and the second pump toward an outside of the pump assembly.


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