The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2024

Filed:

May. 19, 2016
Applicant:

Dst Innovations Limited, Bridgend, GB;

Inventor:

Anthony Miles, South Glamorgan, GB;

Assignee:

DST INNOVATIONS, LTD., Bridgend, GB;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/209 (2017.01); B29C 64/118 (2017.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01); H05K 3/12 (2006.01); H05K 3/46 (2006.01); B29L 31/34 (2006.01); H01G 4/33 (2006.01);
U.S. Cl.
CPC ...
B29C 64/118 (2017.08); B29C 64/209 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); H05K 3/1241 (2013.01); H05K 3/1283 (2013.01); H05K 3/4664 (2013.01); H05K 3/4682 (2013.01); B29L 2031/3425 (2013.01); H01G 4/33 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/013 (2013.01); H05K 2203/074 (2013.01); H05K 2203/107 (2013.01); H05K 2203/163 (2013.01);
Abstract

A circuit board and component fabrication apparatus comprises a print head configured to deposit one or more materials on a substrate so as to print electronic circuit boards and/or components.


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