The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2024
Filed:
Jan. 31, 2020
Applicant:
Nissei Asb Machine Co., Ltd., Nagano, JP;
Inventors:
Assignee:
NISSEI ASB MACHINE CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 49/48 (2006.01); B29B 11/08 (2006.01); B29C 49/06 (2006.01); B29C 49/64 (2006.01); B29C 49/68 (2006.01); B29C 49/78 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 49/06 (2013.01); B29B 11/08 (2013.01); B29C 49/4823 (2013.01); B29C 49/6427 (2013.01); B29C 49/6458 (2022.05); B29C 49/6463 (2013.01); B29C 49/68 (2013.01); B29C 49/786 (2013.01); B29C 49/78 (2013.01); B29C 2949/078 (2022.05); B29L 2031/7158 (2013.01);
Abstract
A blow molding device is provided in which a preform is injection-molded. The injection-molded preform is temperature-controlled by a temperature adjusting unit, and the temperature-adjusted preform is blow-molded, wherein the temperature adjusting unit has a multistage structure in which an uppermost stage has the highest temperature structure, and the mold surface temperatures of lower stages and other than the uppermost stage are set to be 10° C. or more lower than the glass transition temperature of the preform.