The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2024
Filed:
Jun. 29, 2020
Kobayashi & Co.,ltd., Tokyo, JP;
Keisuke Sakai, Matsudo, JP;
Nanae Tanaka, Matsudo, JP;
KOBAYASHI & CO., LTD., Tokyo, JP;
Abstract
The objective of the present invention is to provide a mold-release film that docs not contaminate the mold or the formed body. This invention provides a mold-release film comprising a base material layer formed from a thermoplastic resin, and a surface layer formed from a resin composition layered on at least one surface of the base material layer. The mold-release film has a trouser tear strength, conforming to JIS K 7128-1, of 5 N/mm or stronger. The resin composition has a peel strength of 15 mN/30 mm or weaker, as measured at 175° C. in accordance with JIS Z0237. The resin composition has an elongation at break of 70% or greater, as measured at 175° C. in accordance with JIS K 7127.