The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2024
Filed:
Dec. 24, 2019
Mitsubishi Heavy Industries, Ltd., Tokyo, JP;
Yusuke Kobayashi, Tokyo, JP;
Noriya Hayashi, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
Provided is a method for making a mold of a gap between components, the method comprising: a step for preparing a curable composition by mixing a resin material with a curing agent that promotes curing of the resin material; a step for cooling the curable composition (M) to a predetermined temperature at which curing of the curable composition is not initiated, so as to manufacture a mold-making kit; a step for placing the mold-making kit in a gap between a first member and a second member so as to fill the gap; a step for curing the mold-making kit between the first member and the second member to mold the mold-making kit into the shape of the gap; and a step for removing the cured mold-making kit from the gap.