The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2024

Filed:

Apr. 18, 2019
Applicant:

Hunan Taohuajiang Bamboo Science & Technology Co., Ltd., Hunan, CN;

Inventors:

Zhiping Wu, Hunan, CN;

Jinbo Hu, Hunan, CN;

Yanhui Xiong, Hunan, CN;

Zhicheng Xue, Hunan, CN;

Ting Li, Hunan, CN;

Zhibin Hu, Hunan, CN;

Yuankun Hu, Hunan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B27D 1/04 (2006.01); B27D 1/10 (2006.01); B27N 3/02 (2006.01); B27N 3/20 (2006.01); B62D 25/20 (2006.01); B62D 29/02 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
B27N 3/02 (2013.01); B27D 1/04 (2013.01); B27D 1/10 (2013.01); B27N 3/203 (2013.01); B62D 25/20 (2013.01); B62D 29/02 (2013.01); B32B 37/12 (2013.01);
Abstract

The invention discloses a bamboo chip integrated material. The bamboo chip integrated material is formed by a plurality of lengthened bamboo chips which are glued and overlaid; each lengthened bamboo chip is formed by a plurality of bamboo chip units which sequentially and continuously mesh and are butted; sharp teeth and grooves are formed in the two ends in the length direction of the bamboo chip units, wherein the sharp tooth of each bamboo chip unit and the groove of the corresponding bamboo sheet unit are matched to form a meshing butt-joint part, and the meshing butt-joint parts of the adjacent lengthened bamboo chips are arranged in a staggered mode; and each bamboo chip unit has a thickness of 4-12 mm and a width of 15-50 mm.


Find Patent Forward Citations

Wu, Zhiping. (2024). Bamboo chip integrated material and manufacturing method thereof (U.S. Patent No. 11919192). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11919192

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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