The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2024
Filed:
Aug. 18, 2022
Applicant:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Inventors:
Keita Muneuchi, Tsurugashima, JP;
Eiji Iso, Tsurugashima, JP;
Isao Ida, Tsurugashima, JP;
Kenichi Araki, Nagaokakyo, JP;
Noriko Shimizu, Nagaokakyo, JP;
Takashi Tomohiro, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/255 (2006.01); B22F 1/102 (2022.01); B22F 1/16 (2022.01); B22F 3/24 (2006.01); C22C 32/00 (2006.01); H01F 1/147 (2006.01); H01F 1/20 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01); H01F 1/22 (2006.01);
U.S. Cl.
CPC ...
B22F 3/24 (2013.01); B22F 1/102 (2022.01); C22C 32/0094 (2013.01); H01F 1/14733 (2013.01); H01F 1/20 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/255 (2013.01); H01F 27/292 (2013.01); H01F 41/046 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C22C 2202/02 (2013.01); H01F 1/22 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/048 (2013.01); Y10T 428/325 (2015.01);
Abstract
An electronic component includes an element body made of a composite material of a resin material and metal powder. A plurality of particles of the metal powder are exposed from the resin material and make contact with one another on the outer surface of the element.