The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2024

Filed:

Mar. 11, 2019
Applicant:

Cellmobility, Inc., Berkeley, CA (US);

Inventors:

Kicheol Hong, Busan, KR;

Hyeji Park, Seoul, KR;

Sukyung Lee, Incheon, KR;

Youngseok Song, Jeollabuk-do, KR;

Gigap Han, Chungcheongnam-do, KR;

Kyungju Nam, Seoul, KR;

Heeman Choe, Walnut Creek, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/11 (2006.01); C22C 9/06 (2006.01); C22C 19/00 (2006.01); B22F 3/00 (2021.01); B22F 3/10 (2006.01); C22C 1/08 (2006.01);
U.S. Cl.
CPC ...
B22F 3/1143 (2013.01); B22F 3/001 (2013.01); C22C 9/06 (2013.01); C22C 19/002 (2013.01); B22F 3/10 (2013.01); B22F 2302/25 (2013.01); C22C 1/08 (2013.01);
Abstract

The successful fabrication of alloy foam (or porous alloy) is very rare, despite their potentially better properties and wider applicability than pure metallic foams. The processing of three-dimensional copper-nickel alloy foams is achieved through a strategic solid-solution alloying method based on oxide powder reduction or sintering processes, or both. Solid-solution alloy foams with five different compositions are successfully created, resulting in open-pore structures with varied porosity. The corrosion resistance of the synthesized copper-nickel alloy foams is superior to those of the pure copper and nickel foams.


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