The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Oct. 14, 2019
Avient Corporation, Avon Lake, OH (US);
Raul Juan, San Mateo de Gallego, ES;
Javier Puyalto, Barbastro, ES;
Renlong Gao, Avon, OH (US);
David Sanchez, San Sebastian de los Reyes, ES;
Avient Corporation, Avon Lake, OH (US);
Abstract
Thermoplastic compounds in the form of a pellet include thermoplastic resin and conductive fibers. The conductive fibers are enveloped by the thermoplastic resin and distributed within the pellet such that each of at least a portion of the conductive fibers is substantially surrounded by the thermoplastic resin and thereby substantially separated from physical contact with any other of the conductive fibers. Additionally, at least a portion of the conductive fibers includes long fibers. The thermoplastic compound, when molded at a thickness of about 3.2 mm, has an electromagnetic shielding effectiveness across a range of frequencies from about 0.5 GHz to about 2.0 GHz of at least about 60 dB according to ASTM D4935, which makes the thermoplastic compound useful for molding thermoplastic articles for shielding against electromagnetic interference.