The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

Dec. 03, 2020
Applicant:

The Florida State University Research Foundation, Inc., Tallahassee, FL (US);

Inventors:

Yanjun Shi, Tallahassee, FL (US);

Sam Yang, Tallahassee, FL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01G 4/01 (2006.01); H01L 23/367 (2006.01); H02M 7/00 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H01G 4/01 (2013.01); H01L 23/3677 (2013.01); H01G 4/1218 (2013.01); H01G 4/1227 (2013.01); H02M 7/003 (2013.01);
Abstract

The disclosure relates to capacitive heatsink devices and systems. In one embodiment, the heat sink capacitor includes a positive (P) bus plate; a negative (N) bus plate; a first dielectric material; a second dielectric material; and a heat sink comprising a first side and a second side, the first side of the heat sink attached to the first dielectric material and the second dielectric material, wherein the first dielectric material and the second dielectric material are separated by a portion of the heat sink, wherein the first dielectric material electrically insulates the P bus plate from the first side of the heat sink to form a first capacitor, and wherein the second dielectric material electrically insulates the N bus plate from the first side of the heat sink to form a second capacitor.


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