The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

Jan. 15, 2018
Applicant:

Iljin Materials Co., Ltd., Jeollabuk-do, KR;

Inventors:

Won Jin Beom, Jeollabuk-do, KR;

Sun Hyung Lee, Jeollabuk-do, KR;

Eun Sil Choi, Jeollabuk-do, KR;

Ki Deok Song, Jeollabuk-do, KR;

Hyung Cheol Kim, Jeollabuk-do, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0355 (2013.01); Y10T 428/12431 (2015.01);
Abstract

The carrier-foil-attached ultra-thin copper foil according to one embodiment of the present invention comprises a carrier foil, a release layer, a first ultra-thin copper foil, a Cu—Al bonding strength improvement layer, an Al layer, and a second ultra-thin copper foil, wherein the release layer may comprise a first metal (A) having peeling properties, and a second metal (B) and third metal (C) facilitating the plating of the first metal (A).


Find Patent Forward Citations

Beom, Won. (2024). Carrier-foil-attached ultra-thin copper foil (U.S. Patent No. 11917755). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11917755

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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