The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

Feb. 17, 2020
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Huijuan Wang, Shenzhen, CN;

Jinsen Cai, Dongguan, CN;

Bin Hu, Shenzhen, CN;

Bo Kong, Hangzhou, CN;

Tian Zhao, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0224 (2013.01); H01L 23/552 (2013.01); H05K 2201/0723 (2013.01);
Abstract

A shielding structure for a system-in-package includes a substrate having stacked first ground planes in the substrate, a second ground plane on a surface of the substrate, and a ground pad arranged along an edge of the substrate disposed on the second ground plane. In addition, ground holes disposed in the substrate electrically couple the adjacent ground planes. The ground holes are arranged in a ring around a board body and spacing between the adjacent ground holes is less than a specified distance in an arrangement that defines a Faraday cage. A device is disposed on the opposing surface of the substrate and a package layer is disposed on the device.


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