The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

Mar. 15, 2022
Applicant:

Chicony Electronics Co., Ltd., New Taipei, TW;

Inventor:

Chien-Yueh Chen, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01);
U.S. Cl.
CPC ...
H05K 1/0212 (2013.01); H04N 23/52 (2023.01); H04N 23/54 (2023.01); H05K 1/0298 (2013.01); H05K 1/056 (2013.01); H05K 1/141 (2013.01); H05K 1/05 (2013.01); H05K 2201/049 (2013.01); H05K 2201/10083 (2013.01); H05K 2201/10106 (2013.01);
Abstract

A circuit board module includes a circuit board, a metal core printed circuit board, and a heating element. The circuit board includes a substrate, and a surface of the substrate has an assembling region. The metal core printed circuit board is on the assembling region and includes a first circuit layer and a second circuit layer. The first circuit layer and the second circuit layer are electrically connected to each other. The second circuit layer is electrically connected to the circuit board. The thermal conductivity of the metal core printed circuit board is greater than the thermal conductivity of the substrate. The heating element is on the metal core printed circuit board and is electrically connected to the first circuit layer. An electronic device having the circuit board module is also provided.


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