The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

Feb. 14, 2021
Applicant:

Ayar Labs, Inc., Santa Clara, CA (US);

Inventors:

Roy Edward Meade, Lafayette, CA (US);

Vladimir Stojanovic, Berkeley, CA (US);

Chen Sun, Berkeley, CA (US);

Mark Wade, Berkeley, CA (US);

Hugo Saleh, Tuscaloosa, AL (US);

Charles Wuischpard, Danville, CA (US);

Assignee:

Ayar Labs, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); H04B 10/80 (2013.01); H04B 10/516 (2013.01); G11C 5/04 (2006.01); G11C 5/06 (2006.01); G11C 11/42 (2006.01); G02B 6/42 (2006.01); G11C 5/14 (2006.01); H04J 14/00 (2006.01);
U.S. Cl.
CPC ...
H04B 10/80 (2013.01); G02B 6/4249 (2013.01); G02B 6/4274 (2013.01); G11C 5/04 (2013.01); G11C 5/06 (2013.01); G11C 5/141 (2013.01); G11C 11/42 (2013.01); H04B 10/516 (2013.01);
Abstract

A remote memory system includes a substrate of a multi-chip package, an integrated circuit chip connected to the substrate, and an electro-optical chip connected to the substrate. The integrated circuit chip includes a high-bandwidth memory interface. An electrical interface of the electro-optical chip is electrically connected to the high-bandwidth memory interface. A photonic interface of the electro-optical chip is configured to optically connect with an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals received through the electrical interface from the high-bandwidth interface into outgoing optical data signals. The optical macro transmits the outgoing optical data signals through the photonic interface to the optical link. The optical macro also converts incoming optical data signals received through the photonic interface into incoming electrical data signals. The optical macro transmits the incoming electrical data signals through the electrical interface to the high-bandwidth memory interface.


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