The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2024

Filed:

Jul. 06, 2023
Applicant:

Semikron Elektronik Gmbh & Co. KG, Nuremberg, DE;

Inventors:

André Schlötterer, Nuremberg, DE;

Harald Kobolla, Seukendorf, DE;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 13/502 (2006.01); H01L 23/04 (2006.01); H01L 23/498 (2006.01); H01R 13/24 (2006.01);
U.S. Cl.
CPC ...
H01R 13/502 (2013.01); H01L 23/04 (2013.01); H01L 23/49811 (2013.01); H01R 13/24 (2013.01);
Abstract

An arrangement having a housing and an electrically conductive contact spring is presented, wherein the contact spring has a first and a second orthogonal main plane along its specified spring direction, wherein it is formed so as to be symmetric with respect to the first main plane, x-z plane, and asymmetric with respect to the second main plane, x-y plane, and also with respect to a rotation through 180° about the specified spring direction. The housing has a spring shaft for receiving the contact spring, and wherein this spring shaft likewise has a first and a second main plane, which coincides with the respective main plane of the contact spring, and wherein the spring shaft is formed so as to be symmetric relative to both main planes. And a power semiconductor module having such an arrangement.


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