The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Nov. 24, 2022
Hkc Corporation Limited, Shenzhen, CN;
Hongyan Chang, Shenzhen, CN;
Zhenya Li, Shenzhen, CN;
Guangjia Wang, Shenzhen, CN;
Bing Han, Shenzhen, CN;
Shishuai Huang, Shenzhen, CN;
Xiaojie Wang, Shenzhen, CN;
Haijiang Yuan, Shenzhen, CN;
HKC CORPORATION LIMITED, Shenzhen, CN;
Abstract
A base substrate and a first metal layer laminated on the base substrate are included. A first laminated portion and a second laminated portion are arranged on and directly contact a side of the first metal layer. The first laminated portion includes a first insulating layer, a second metal layer, a second insulating layer and a first conductive layer. The first laminated portion is arranged with a first via. The second laminated portion includes a third insulating layer and a second conductive layer laminated on the third insulating layer. The second laminated portion is arranged with a second via. The first via is connected to the first conductive layer, the second via is connected to the second conductive layer, and the first conductive layer is connected to the second conductive layer. The second laminated portion is extended to reach an edge of the first metal layer.