The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2024
Filed:
Oct. 13, 2020
Applicant:
Socionext Inc., Kanagawa, JP;
Inventor:
Junji Iwahori, Yokohama, JP;
Assignee:
SOCIONEXT INC., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 27/088 (2006.01); H01L 27/118 (2006.01); H01L 21/822 (2006.01); H01L 21/82 (2006.01); H01L 27/04 (2006.01); H01L 29/78 (2006.01); G11C 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0207 (2013.01); G11C 13/003 (2013.01); H01L 21/82 (2013.01); H01L 21/822 (2013.01); H01L 27/04 (2013.01); H01L 27/0886 (2013.01); H01L 27/11803 (2013.01); H01L 27/11807 (2013.01); H01L 29/785 (2013.01); H01L 2027/11875 (2013.01); H01L 2027/11879 (2013.01); H01L 2027/11881 (2013.01);
Abstract
A semiconductor integrated circuit device includes a standard cell having a plurality of height regions. A plurality of partial circuits having an identical function and each operating in response to common signals S and NS are arranged in any one of the height regions. A metal interconnect forming part of a supply path for the common signal S is arranged in the height region so as to be connected to the partial circuits, and a metal interconnect forming part of a supply path for the common signal S is arranged in the height region so as to be connected to the partial circuits.